JPH0735400Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0735400Y2 JPH0735400Y2 JP1987071364U JP7136487U JPH0735400Y2 JP H0735400 Y2 JPH0735400 Y2 JP H0735400Y2 JP 1987071364 U JP1987071364 U JP 1987071364U JP 7136487 U JP7136487 U JP 7136487U JP H0735400 Y2 JPH0735400 Y2 JP H0735400Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- substrate
- circuit board
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 230000008602 contraction Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071364U JPH0735400Y2 (ja) | 1987-05-13 | 1987-05-13 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071364U JPH0735400Y2 (ja) | 1987-05-13 | 1987-05-13 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63180934U JPS63180934U (en]) | 1988-11-22 |
| JPH0735400Y2 true JPH0735400Y2 (ja) | 1995-08-09 |
Family
ID=30913850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987071364U Expired - Lifetime JPH0735400Y2 (ja) | 1987-05-13 | 1987-05-13 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735400Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS428652Y1 (en]) * | 1964-05-13 | 1967-05-09 | ||
| JPS5866647U (ja) * | 1981-10-26 | 1983-05-06 | 三洋電機株式会社 | 混成集積回路の封止構造 |
-
1987
- 1987-05-13 JP JP1987071364U patent/JPH0735400Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63180934U (en]) | 1988-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5367124A (en) | Compliant lead for surface mounting a chip package to a substrate | |
| US6531770B2 (en) | Electronic part unit attached to a circuit board and including a cover member covering the electronic part | |
| US5612259A (en) | Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame | |
| US4949225A (en) | Circuit board for mounting electronic components | |
| JPH0685161A (ja) | 高密度実装型半導体装置 | |
| KR0147397B1 (ko) | 반도체장치 및 그 제조방법 | |
| US5099395A (en) | Circuit board for mounting electronic components | |
| KR0157857B1 (ko) | 반도체 패키지 | |
| JP3169578B2 (ja) | 電子部品用基板 | |
| JPH0735400Y2 (ja) | 混成集積回路 | |
| JP2620611B2 (ja) | 電子部品搭載用基板 | |
| JP2544272Y2 (ja) | 混成集積回路 | |
| JP2602834B2 (ja) | 半導体装置 | |
| JPH06188335A (ja) | 樹脂封止形半導体装置 | |
| KR100280597B1 (ko) | 반도체장치와반도체장치유닛및반도체장치유닛의제조방법 | |
| JP2925814B2 (ja) | 混成集積回路 | |
| JP2544273Y2 (ja) | 混成集積回路 | |
| JP2552514Y2 (ja) | 混成集積回路 | |
| JP2792958B2 (ja) | 混成集積回路装置 | |
| JP2737332B2 (ja) | 集積回路装置 | |
| JP2854041B2 (ja) | 混成集積回路装置 | |
| JPH07170048A (ja) | フレキシブルプリント配線板の部品実装構造及び部品実装方法 | |
| JP2810453B2 (ja) | 混成集積回路装置 | |
| JPH11340377A (ja) | 表面実装型半導体装置 | |
| JP2531852Y2 (ja) | ハイブリッドｉｃ用端子構造 |